Rambus Provides Specs on DDR5 and HBM3
Rambus has announced the specs for its upcoming DDR5 and HBM3 memory. These specifications are early so they could change, but we do know a few things for certain.As most of our readers likely know, DDR5 will be the successor to DDR4 and HBM3 will succeed HBM2. Now, onto the announcement.
While most of this information is subject to change, Rambus has confirmed that HBM3 will offer at least twice the performance of HBM3 and DDR5 should offer anywhere from 1.5 to 2 times the performance of DDR4. In the case of HBM3, Rambus has confirmed that it will offer a transfer rate of 4GT/s which would put the final bandwidth speed anywhere from 512 GB/s to 1 TB/s per package. The current generation HBM2 hardware offers transfer speeds of 2GT/s. This increase in speed should ensure that future GPUs don’t run into any performance issues.
DDR5 offers an increase over its predecessor as well though not as drastic a one as offered by HBM3. Rambus has said that it expects DDR5 to offer transfer speeds of 4.8 GT/s to 6.4 GT/s. Currently, DDR4 speeds clock in at around 3.2 GT/s. So, based on those numbers, we can assume that under ideal circumstances DDR5 will double the speeds of DDR4.
Both of these are expected to be manufactured using a 7nm process. Currently, the majority of PC hardware uses a 10nm process so this also gives us a rough estimate of when we’ll see these new forms of hardware hit the market. Based on what we know, it’s likely that DDR5 and HBM3 will hit store shelve sometime in 2019.
It is possible that increased competition from the likes of AMD could spurn Rambus to launch HBM3 a bit earlier, but even so, it would be surprising if we saw it before 2019. In terms of DDR5, Rambus already has functional DDR5 silicone, but the 7nm process will likely delay things.
Eric is an avid tech junkie, gamer, and comic fan. When he's not working on his PC, you'll find him at your local comic book shop.