Qualcomm’s Snapdragon 845 Chip Will Be Built Using 7nm Process
Qualcomm’s Snapdragon 835 is currently the top of the line system on chip for smartphones, but there are reports that the San Francisco-based company has began work on the next generation of mobile phone SoCs which will be dubbed the Snapdragon 845. The reports suggest that the 845 will be created using a 7nm process developed by TSMC.
The 7nm process means that it will be smaller than the 835 and be at least 25 to 35 percent more powerful than the current Snapdragon. Beyond that, we don’t have too many details regarding the 845’s specs.
The chip is expected to be ready for production by early 2018 and will likely be first used in Samsung’s Galaxy S9. This also implies that Samsung’s S9 will be unveiled at 2018’s Mobile World Congress which will take place in February.
It is possible that the 845 will be unveiled at an upcoming press event in Beijing, but that has yet to be confirmed.
In addition to the 845, Qualcomm is also expected release a new midrange chip later this month. Dubbed the Snapdragon 660, it will serve as the successor to the current Snapdragon 652. The 652 is designed for mid-range smartphones so we’ll likely see it on the Samsung C10, Nokia 7 and 8, and similar phones.
Eric is an avid tech junkie, gamer, and comic fan. When he's not working on his PC, you'll find him at your local comic book shop.