Designs For New Xeon Motherboards Leaked
In expectation of the release of the newest line of Intel Xeon CPUs for enterprises, the specifications for new motherboards designed to accommodate the new processors was leaked. Manufactured by Tyan, a well-known provider for Intel, the new mobos will feature two sockets for LGA3647 — that’s the assigned serial number for the new Xeon — chips, as well as enhanced airflow and six DRAM channel with one DIMM each.
The leak consists of one image as well as the presumed specs for the new motherboards, so the usual grain of salt is advised. One piece of information that may already cast some suspicions on this leak is that the Xeon motherboards are supposedly able to handle up to 205W, while the processors announced by Intel need 215W to 260W. This would be a rather odd oversight by Tyan, so it could either be a mistake or other mobos are in the works besides these two. Either way, someone is likely going to be in big trouble for bringing this news to the world.
However, when taken as true, the specs are impressive even for an enterprise board: the new Xeon motherboards would support up to two CPUs and would have 768GB of RDIMM/LRDIMM DDR4-2666 to distribute between them. PCIe slots abound as well with four primaries as well as secondaries for each one: it is rumored that the Xeon’s themselves will support several PCIe lanes as well, raising those totals even further.
Though it is hard to tell from some grainy photos and some untested specs, it seems that the new Xeon motherboards are built to house a very powerful new processor indeed. Though nothing is known officially about the new Intel chips, this leak will likely fuel plenty of speculation in the weeks to come.
Fergus has been tinkering with computers since he was a kid and likes to put a stop to parties by listing the specs of all the digital devices in the room. It's best not to let him near your computer since he'll take it apart and may not put it back together again before he leaves.