Leaked Photos Reveal Four New iPhone 7 PCBs
With Apple expected to unveil the next generation iPhone 7 in a month, leaked photos of the upcoming smartphone are making rounds on regular basis. Today, serial leakster Steve Hemmerstoffer has posted new photos of iPhone 7 PCBs.
Hemmerstoffer keeps on scouring the Chinese Weibo in an attempt to find new photos of the Apple’s upcoming flagship device. This time he came across photos showing motherboard of the new iPhone. Photos can be seen below which contain four iPhone 7 PCBs.
While the iPhone 7 PCBs resemble those of the iPhone 6s’ for the most part, if you take a close look at the images above, you will see the differences. Not only do the holes for the screws that are used to fasten the housing vary, but also the overall appearance and shape–though the changes are not that enormous.
If previous rumors are to be believed, the iPhone 7 models are going to sport a powerful A10 SoC. The phone would also see a significant RAM upgrade, as well as could feature LTE modems from two different companies for different carrier networks. According to a previous report, Intel modems will be reserved for AT&T iPhone 7 models, while those from Qualcomm are said to be for Verizon and all Chinese models.
Moreover, the Cupertino giant is reportedly planning a larger version of iPhone 7 that will feature a 3,100mAh battery, paired with an on-board storage upgrade to 256GB.
Rumor also has it that Apple will adopt a new chip developing technology for iPhone 7. Dubbed FoWLP, which stands for fan-out wafer level packaging, the tech will help smartphone OEMs to reduce the thickness of their mobile devices by at least 0.3mm, while increasing the efficiency of chips by 30 per cent.