Samsung’s New FoWLP Tech, No PCB, Thinner Phones, Apple in Sight
Samsung’s new FoWLP tech does not require a PCB, this means that Samsung can make their smartphones thinner, yes even more thinner.
Samsung has beaten other smartphone brands time after time when it comes to new innovation and with the new S7 series smartphone they also have the upper hand in design as well has power.
With the mobile market trends going towards bezel-less and slim designs and more battery efficient smartphones becoming people’s preference it seems like Samsung’s new FoWLP tech will play a vital role in the years to come.
But what is FoWLP? Fan-Out Water Level Packaging, allows smartphone manufacturers to reduce the thickness of the phones. This is a big deal now as people are looking for slimmer and lighter phones. Manufacturers are also stressing about the thickness of their devices and competing against each other to make the world’s slimmest phone ever.
Samsung’s new FoWLP tech also does not need a PCB, this increases the efficiency of the phone by 30% which is a significant performance boost. With this new tech Samsung can reduce the thickness of future products by at least 0.3mm. We know that when it comes to thickness of a smartphone even single point of a mm can be a deal breaker.
The smartphone market is a very competitive one and companies spend millions of dollars on RnD so that their new products have a unique selling point and have an edge over the competition. It seems that Samsung’s new FoWLP tech will give the company the edge they need to come on top yet again.
People have already seen that Apple is lacking behind when it comes to innovation and we have seen a decline in sales ever since Steve Jobs died. It is evident then that Samsung will be coming on top after all due to their innovation in the smartphone market year after year.
There have been rumors and some confirmations about Apple testing the waters for other potential markets and it seems that the company has other plans for the future. Apple’s current supplier of 10nm FinFET processors is TSMC and with demands going up we might see Samsung stepping in to get a share of the pie as well.