TSMC Plans to Launch 7nm Trials in H1 2017, Mass Production Starts in 2018
Taiwan Semiconductor Manufacturing Company (TSMC) is set to launch 7nm trial production in the first half of 2017, with mass production to be ramped up in H1 2018. This is according to a recent report from company chairman Morris Chang who mailed it to TSMC’s shareholders.
Only a few days ahead of this shareholder report publication, TSMC co-CEO Mark Liu talked about their 7nm plans at the investors meeting on April 14. Liu said that the company has more than 20 customers already engaged with the foundry on its 7nm process node, and they expect to have 15 customer tape-outs in 2017. DigiTimes reports:
TSMC’s 7nm technology leverages 95% the same equipment as 10nm, said Liu, adding that the company is “well on track” with its 7nm development. “N7 is a further extension of N10 technology, with more than 60% in logic density gain and 30% to 40% reduction in power consumption,” Liu indicated.
Liu further noted that the 7nm node technology will target production for both mobile and high-performance computing applications, while its 10nm process is focused mainly on producing mobile chips.
TSMC hopes to bring 7nm chips on the market by 2018, and the Extreme UltraViolet (EUV) lithography based 5nm ones by 2020.
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