MediaTek Helio X30 in Production with 10nm FinFET with TSMC?
Some more details have been leaked about MediaTek’s upcoming chipset Helio X30, with which, the company is already boasting to take on the likes of Snapdragon 820.
While official word on the SOC is yet to surface, some details seem to have leaked online suggesting that instead of 14nm FinFET technology, the X30 is actually using 10nm FinFET technology.
Now we know that Apple has contracted TSMC to develop their A10 chips, and if they are pushing the entirety of the stock for them, it suggests that may be MediaTek will also ditch Samsung and go with TSMC on this one. However, this is pure speculation at the moment.
Moving on, the alleged leak suggests that the Helo X30 is already in development and will be out in the market by next year i.e. 2017.
Being manufactured using the 10nm FinFET process, we can assuredly say that MediaTek’s next System on a Chip is going to boast of being the most efficient as well as being the best in terms of performance.
That being said, Helio X30 is going to support ARM Mali-T880, 2 x LPDDR4 RAM ePOP, 4 GB eMMC 5.1 (up to), and up to 26MP camera sensor. Also, it is going to have 10 cores just like Helio X20 but with the following configurations:
- 2 x Cortex-A72 cores at 2.8 GHz
- 4 x Cortex-A53 cores at 2.2 GHz
- 4 x Cortex-A35 cores at 2.0 GHz
So tell us, what do you make of all that?