AMD Zen High End ‘Exascale’ CPU and APU Specs Leaked
At a recent IT technical forum discussion, a CERN engineer revealed that AMD Zen would arrive at some point in a 32-core implementation. The 32-core CPUs will be aimed at the data center and other enterprise class applications.
The slide from the engineer’s presentation also confirmed previous claims that Zen will bring up to a 40 percent improvement in instructions per clock (IPC) over their current lineup, and that it would launch with a Symmetrical Multi-threading (SMT) design.
Apart from that, AMD is also building an enterprise-grade APU that features four dies on a single MCM (Multi-Chip Module) package. The APU is designed with a die-optimized version of Polaris GPU integrated onto the CPU packaging.
Based on information we have so far, below are the two distinct processors included in AMD’s enterprise line-up:
AMD Zen High End ‘Exascale’ CPU, 1-4 Socket (1P-4P) – Specs As Per CERN
- 32 ZEN x86 Core, 6-wide
- 12 8KB L0 Cache (4KB per core)
- 2 MB L1 D-Cache (64KB per core)
- 2 MB L1 I-Cache (64 KB per core)
- 16 MB L2 Cache (512 KB per core)
- 64? MB L3 Cache (8MB cluster per quad unit)
- 576-bit Memory Controller (8×72-bit, 64-bit + 8-bit ECC)
- 204.8 GB/s via DDR4-3200 (ECC Off)
- 170.6 GB/s via DDR4-2666 (ECC On)
AMD Zen High End Exascale APU, 1-2 Socket (1P-2P) – Specs From Fast Forward
- 16 ZEN x86 Core, 6-wide
- 64 KB L0 Cache (4KB per core)
- 1 MB L1 D-Cache (64KB per core)
- 1 MB L1 I-Cache (64 KB per core)
- 8 MB L2 Cache (512 KB per core)
- No L3 Cache
- 288-bit CPU Memory Controller (4×72-bit, 64-bit + 8-bit ECC)
- 102.4 GB/s via DDR4-3200 (ECC Off)
- 85.3 GB/s via DDR4-2666 (ECC On)
- 102.4 GB/s between CPU and GPU via GMI
- ~2000-core Polaris GPU
- 2048-bit GPU Memory Controller
- 8 GB HBM2 SGRAM Memory (2 chips at 4GB)
- 512 GB/s GPU Bandwidth
Based on the 14nm FinFET process, the high-end ‘Exascale’ CPU will be manufactured by GlobalFoundries Fab8 in New York state, while the Zen APU is expected to be manufactured by Samsung Semiconductor. Both processors will be launched later this year, with the consumer parts planned for 2017.
Source: VR World