Motorola Moto X 2016 Leaked Image Shows Presence Of A Heatpipe
While it may not have a concrete release date yet but there have been plenty of leaked images of Motorola’s fourth generation smartphone, Moto X 2016. This recent leaked image from a Chinese website, which claims it acquired the image from an internal source, highlights something really interesting about the phone.
The image, of the internal design of the phone, shows that the Moto X 2016 might be using a heatpipe in what is pretty much a first for smartphones. Usually, heatpipes are used in PCs to dissipate extra heat generated by components, typically in an overclocking scenario.
The presence of the heatpipe to spread and dissipate heat away from the CPU in the smartphone seems to suggest that the Moto X 2016, powered by Qualcomm’s latest Snapdragon 820 CPU will feature overlocking options. Motorola’s Moto Maker already allows users to customize their phone’s physical appearance so it may not be much of a stretch to imagine Overclocking functionality being added to future devices.
Overclocking may not be the only reason for the heatpipe as Snapdragon chips are known to run at very high temperatures and even Samsung is rumored to be using heatpipes for their Galaxy S7, which also uses Snapdragon 820.
After the disastrous overheating issues with Snapdragon 810, Qualcomm assured users that the future will be different so this might be a way to ensure that next generation chips run at lower temperatures.
Judging from the image and the state of the phone, it seems that Moto X 2016 is pretty much ready to be shipped out and will most probably be available in the first quarter of 2016.