Galaxy S7 Rumored To Have Heat Pipes To Counter Snapdragon Overheating Issues
One of the biggest issue with many smartphones and tablets, especially ones with big screens and a pretty powerful processor, is the fact that with prolonged use (involving Wi-Fi or media player) the devices heat up significantly. Samsung however seems to have found a solution to this problem for their upcoming flagship smartphone, Galaxy S7.
Qualcomm’s Snapdragon chipset family is known for overheating even if the manufacturer themselves denies it. A few months ago, rumors emerged about their upcoming Snapdragon 820 chipset being plagued by overheating issues and since Galaxy S7 is expected to use the same chipset (or maybe Exynos 8890), many people were rightly worried.
A recent report claims that the upcoming Samsung Galaxy S7 might integrate a heat pipe. Samsung is allegedly experimenting with various heat pipe types and shapes, and the manufacturer is said to decide for or against this heat-dissipation solution by the end of the year. Note that the Samsung Galaxy S7 wouldn’t be the first smartphone to integrate a heat pipe.
There are other devices out there including Xperia Z5 Premium and OnePlus 2, all powered by Snapdragon 810, which utilized a somewhat similar method for heat dissipation.
According to rumors, the Samsung Galaxy S7 will come in two versions: one based on the Exynos 8890 chipset and one based on the Qualcomm Snapdragon 820. At this point, it should be mentioned that all smartphone chips throttle performance when dangerous temperature levels are reached and that a more effective heat dissipation system is likely to improve the overall performance of any mobile SoC. However, the heat pipe might only be limited to the S7 powered by Snapdragon 820.
Source: Phone Arena
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