AMD Fiji GPU Die Shots Explain Architectural Benefits
Die shots of AMD Fiji chip from the Radeon R9 Fury series have finally surfaced, revealing intricate details of the most technically advanced GPU. The images, posted by the chip analyst ChipWorks, give us first clear look at AMD’s two most recent GPU designs, the 359mm^2 Tonga silicon and the newest 596mm^2 Fiji silicon.
In contrast to AMD’s Tonga based GPUs using GDDR5 memory, the Fiji is built on the new HBM memory architecture, which gives it the benefits of lower memory power draw as well as increased bandwidth. The benefits do not end there though.
The die shots show that the new Fiji silicon is exceptionally dense, with the 4 1024-bit HBM memory bus segments packed up in roughly the same space as Tonga’s GDDR5 64-bit memory bus. That means HBM also saves the die space and allows AMD to produce these chips using less silicon, reducing the production costs.
Moreover, GPUs using HBM take up 50% less PCB space than the equivalent GDDR5 GPU, which again makes them less expensive to produce as well as giving the GPU a smaller form factor. Another benefit of having the HBM memory is that all of the heat output out of the GPU is coming from one central location, which allows for simplified GPU heatsink designs.
HBM is undoubtedly the future of GPU memory, especially with the HBM2 generation that will take the whole thing to the next level.
Featured Image: WCCFtech
Gohar is the lead editor at TechFrag. He has a wide range of interests when it comes to tech but he's currently spending a big chunk of his time writing about privacy, cyber security, and anything policy related.