Researchers Show Off Direct-to-Silicon Liquid Cooling Tech
Researchers at the Georgia Institute of Technology have come up with a new idea of liquid cooling which does not require a water block.
Liquid cooling has become something of a necessity for every PC enthusiast. It essentially pulls the heat away from CPU, GPU in water-filled tubes to a radiator thus providing better cooling solution than a traditional heatsink.
The whole procedure usually requires a waterblock which pulls heat away from CPU and GPU. The researchers at GIT, however, have managed to connect the chip directly to the liquid loop without needing any waterblock.
Speaking of this, Muhannad Bakir, an Associate Professor in the Georgia Tech School of Electrical and Computer Engineering said:
We believe we have eliminated one of the major barriers to building high-performance systems that are more compact and energy efficient. We have eliminated the heat sink atop the silicon die by moving liquid cooling just a few hundred microns away from the transistors. We believe that reliably integrating microfluidic cooling directly on the silicon will be a disruptive technology for a new generation of electronics.
Since I’m no expert when it comes to electronics, I recommend checking out more details on the project which are available for everyone at Georgia Tech website.
The results, on the other hand, provided 60 per cent increased cooling when compared to air cooling. The project also gathered wide appreciation from Defense Advanced Research Projects Agency which funded the entire project.
We have created a real electronic platform to evaluate the benefits of liquid cooling versus air cooling. This may open the door to stacking multiple chips, potentially multiple FPGA chips or FPGA chips with other chips that are high in power consumption. We are seeing a significant reduction in the temperature of these liquid-cooled chips.
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