Xilinx Starts Shipping 16nm Zynq UltraScale+ Chips Ahead of Schedule
Xilinx, makers of programmable logic devices, announced this week that they had manufactured the first customer shipment of their Zynq UltraScale+ processing solution. The chip is designed using the second-generation 16nm FinFET process technology (CLN16FF+) with increased performance and low power consumption.
“TSMC’s ongoing collaboration with Xilinx has resulted in the early shipment of a world class 16nm FinFET multiprocessing SoC,” said BJ Woo, vice president of business development at TSMC. “Xilinx and TSMC have clearly demonstrated and delivered industry-leading silicon performance with the lowest power consumption, and highest level of systems integration and intelligence among all programmable logic products to date.”
The Xilinx Zynq UltraScale+ all-programmable multi-processor system-on-chip (AP MPSoC) features four ARM Cortex-A53 general-purpose cores, two ARM Cortex-R5 real time processing units, and an ARM Mali-400 graphics processor. In addition, the MPSoC includes integrated peripherals, safety and security engines, and advanced power management.
The developer states the Zynq UltraScale+ chips were shipped to an undisclosed customer about a quarter ahead of schedule, though it won’t reveal details about the volumes. Whatsoever, the company’s ability to sell the A0 revision of a chip indicates that the product is fully-functional and meet performance targets.
“The early delivery of our Zynq UltraScale+ MPSoC 16nm device extends our outstanding track record for total execution and absolute quality. We call this a “Three-Peat” – being first to market with leadership products at 28nm, 20nm, and now at 16nm,” said Victor Peng, executive vice president and general manager of the programmable products group at Xilinx.
The Zynq UltraScale+ is specifically tailored to meet the unique requirements of next-gen embedded vision, including advanced driver assistance systems (ADAS), surveillance, industrial-IoT, 5G wireless systems and others.