Snapdragon 810 Doesn’t Breathe Fire in Xperia Z5 Thanks to Dual-Pipe Method
Qualcomm’s 810 Snapdragon SoC is notorious for its overheating issues. The chip actually throttles early and a bit too often which results in its getting too hot than what you would expect from it.
However, it appears that Sony has managed solved this problem with its newest Xperia Z5 lineup by using a dual heatpipe to cool it down.
A teardown done by the Chinese Weibo website reveals that both the Xperia Z5 Premium and the Xperia Z5 feature a dual heatpipe cooling solution, established to transport heat away from the Snapdragon 810.
The image of a torn-down Z5 Premium shows that the Japanese company has incorporated two copper pipes that run across the top half of the phone above where the battery goes in. This internal design allows the 810 to reach its full potential, keeping it away from breathing fire.
Earlier tests already showed that the Xperia Z5 Premium, which features a 4K screen, does heat up but not as much as previous handsets running on the 810 chipset.
While the first reviews of the Xperia Z5 smartphones are yet to surface, it appears that Sony has worked out the kinks of the Snapdragon 810 SoC.
Gohar is the lead editor at TechFrag. He has a wide range of interests when it comes to tech but he's currently spending a big chunk of his time writing about privacy, cyber security, and anything policy related.