Qualcomm Developing Chips Which Incorporate WiFi And LTE
Yesterday, Qualcomm showcased its FSM90xx system-on-a-chip (SoC), which the company claims will allow users to experience improved 4G wireless Internet service wherever they go.
According to Qualcomm officials, the new chip will have the ability to create wireless access points in order to offer consumers indoor and outdoor wireless coverage using WiFi and cutting-edge 4G LTE technology. The SoC is based on 28-nanometer technology, allowing Qualcomm to improve power consumption and lower the cost.
By harnessing the core strength of the chip, Qualcomm is fully geared towards developing smartphones and portable devices, which can support between four to sixteen users in a small network.
Dan Rabinovitsj, the Senior Vice president at Qualcomm, remarked that:
“We have significantly cut the cost of the silicon. We are pretty, I’d say, ambitious about how fast this can have an impact on the portfolio of products our customers can build.”
The chip will be a part of the tech company’s “small cell” push initiative, which enables wireless service providers to recycle their licensed wireless spectrum by decreasing the radius of the cell area.
Qualcomm explains that the new chip breaks previous technological barriers in the wireless 4G LTE signal projection thanks to a reduced cell site, which innately enables it to be used indoors and outdoors.
In order to support faster LTE speeds, the chip will make use of “Carrier Aggregation.” This technology enables networks to prioritize resources by creating two channels in frequency bands, which theoretically result in almost two times the speed gain.
Puneet Sethi, the staff product manager for Qualcomm Atheros, gives some insight regarding the technology by explaining that presently, wireless service providers have the ability to improve their 3G services by making use of “femto cells.” However, it would only enhance voice communication for customers who were suffering from poor signal problems.
“This product is designed to help wireless operators fill coverage holes. One of the big differences is that it delivers this functionality in a form factor and with performance characteristics that are suitable for inclusion in a residential gateway.”
Qualcomm has said that the chip will be made available in the market during the second half of the next year.
I guess, we will have to wait and see how this product performs, and if it lives up to the hype Qualcomm has created around it. Until then, we will reserve our judgement.